Meet FieldFab:

the expeditionary 3D printer designed for the world’s extreme environments.

Replace mission-critical parts in the field, reducing lead time and enabling materiel readiness.

Conforming to MIL-STD-810H, FieldFab has demonstrated consistent performance, even when subjected to:

  • Extreme cold (-40°C), extreme heat (50°C), and high altitude

  • Temperature and humidity cycling

  • Rain and condensation

  • Operational shock and vibration

Print advanced materials continuously, even during tactical transport on land, sea, or in air.

Our capabilities result from being embedded within USMC and Army units for over 3 years, codeveloping systems with warfighters.

As a part of a Cooperative Research and Development Agreement (CRADA) with USMC, NIWC Pacific, and US Army CCDC, FieldFab has been tested, refined, and deployed in over 29 field exercises alongside the Army, Navy, Marines, SOF, and Joint Forces.

Print advanced, high-temperature materials with a low training burden.  

FieldFab is compatible with all polymer-based 3D printing filaments.

Direct Metal Replacements


Biocompatible Parts


Flexible Parts


Standard Parts

Technical Specifications

3D PRINTING

Nozzle Temperature < 500°C (932°F)
Bed Temperature < 200°C (392°F)
Chamber Temperature < 80°C (176°F)
Print Volume 280mm x 280mm x 280mm
(11.02” x 11.02” x 11.02”)
Supported Materials All standard polymer filaments and polymer- based composites (i.e. ULTEM, TPU, Nylon-CF, PETG, Nylon, PLA, etc.)

MECHANICALS

Housing LMDP plastic exterior, aluminum print shell
Dimensions 24” x 26” x 39”
Weight 190 lbs

ENVIRONMENTALS

Temperature Operational: 40°C* to 50°C (-40°F* to 122°F)
* automatic system pre-heat enabled
Storage: -40°C to 70°C (-40°F to 158°F)
Certifications MIL-STD-810H, AS9100D/ISO9001, Made in USA

INTERFACE / ELECTRONICS

Digital Interface GETAC F110 with design suite, digital data vault access
Power 80V—264V, 47Hz—63Hz (AC outlet)
Power Consumption 1.2kW peak, 10A Max

In extreme conditions,
FieldFab prints to spec.